| 摘要 |
PURPOSE:To improve heat conductivity and to enable effective cooling of a sample by forming metallic thin film layers on both surfaces of an elastic heat conductor in order to obtain a heat conductive medium and welding the heat conductive medium on a sample mounting surface. CONSTITUTION:A heat conductive medium 8 obtained by forming metallic thin film layers 7 on both surfaces of an elastic heat conductor 2 is welded on a sample mounting surface 11 of a platen 1 by the use of a low melting point metallic material. This heat conductor medium 8 is obtained, for example, when metallic thin layers 7 of aluminium, gold, silver, or the like are formed by performing chemical plating or vacuum evaporation or the like on both surfaces of the heat conductor 2 which is formed by mixing heat conductive corpuscles of alumina, carbon, gold, or the like with elastic and heat-resisting silicone rubber. Therefore, even if heat generation of the wafer 3 occurs by radiation processing of ion beams, the heat is transferred from the wafer 3 to the heat conductor 2 via one metallic thin film layer 7 of small heat resistance in the heat conductive medium 8, and the heat is transferred quickly to the platen 1 welded by the use of the low melting point metallic material via the other metallic thin film layer 7 so as to perform cooling of this device. Hence, a temperature rise in the wafer 3 can be suppressed. |
