| 摘要 |
PURPOSE:To obtain a lead material for ceramic package excellent in heat resistance and having high electric conductivity and accordingly excellent in heat dissipation property, by providing a composition consisting of respectively prescribed amounts of Ni, Si, Ti, Sn, and Zn and the balance Cu with inevitable impurities. CONSTITUTION:The titled lead material has a composition consisting of, by weight, 0.1-4.5% Ni, 0.05-1.2% Si, 0.01-0.5% Ti, 0.01-3.5% Sn, 0.01-5.0% Zn, and the balance Cu with inevitable impurities. The lead material of this invention has electric conductivity and heat dissipation property superior by far to those of the conventional alloy, and also has superior heat resistance, strength, solderability, plating suitability, etc., equal to those of the conventional alloy. Accordingly, this material is suitable as lead material for ceramic package of side prase type or pin grid array type in an electronic equipment.
|
