| 摘要 |
<p>PURPOSE:To cause a mold resin to be bonded with the plated part having the uneven surface and thereby improve the bonding intensity by forming a plate part of lead frame and a plating region of the plating part with external lead larger than the external circumference of mold resin. CONSTITUTION:The external side plated portions 6a, 7a are external Ag plated portions where the plating is carried out up to the outside exceeding the external circumference of the mold resin 5. Namely, the plating regions of Ag-plated portions 6, 7 having the uneven surface provided to the plate 1 and external lead 4 are extended respectively up to the external side of mold resin 6. The junction parts of plate part 1 of lead frame and respective mold region 5 of external lead 4 is joined with the Ag-plated part 6 having the uneven surface by extending such plated region, and thereby bonding strength at the joining portions becomes large and exfoliation at the joining part can be prevented.</p> |
