| 摘要 |
PURPOSE:To remove danger generating a short-circuit by mounting a wiring chip having a crossover wiring function on a glass substrate. CONSTITUTION:A part of a common circuit 3 is removed and a wiring chip 7 is arranged on the removed part. The wiring chip 7 is a semiconductor chip having only a wiring function by forming wiring layers 7A, 7B and a via hole 7C on front and rear faces. The semiconductor chip 2 is connected to the chip 7 by a bonding wire 4 through a relay circuit 8 and then connected to the common circuit 3. Thereby, crossover is executed only at the wiring layer on the chip 7 mutually connected through the via hole 7C and the circuit on the glass substrate 1 is not crossed with the bonding wire 4. Consequently, the bonding wire 4 does not cross the circuit and the circuit can be prevented from the generation of short-circuit caused by the sagging of the bonding wire 4. |
