| 摘要 |
PURPOSE:To provide the titled laminate outstanding in punching process-ability and warpage dimensional accuracy, small in dimensional shrinkage and thermal expansion coefficient, suitable for printed circuit base plates, etc., constituted, as the base, of specific base paper derived from coniferous pulp. CONSTITUTION:A paper base made up of base paper derived from coniferous pulp containing >=95wt.% of alpha-cellulose is impregnated with a thermosetting resin (e.g., phenolic resin, epoxy resin) followed by drying to make a prepreg. A plural of said prepreg are superposed followed by hot press molding to obtain the objective laminate.
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