| 摘要 |
PURPOSE:To make step and repeat exposure of a wafer be exactly practicable, by making step driving of a stage be corrected by a value which is integer times the value related with a dimension of a chip pattern. CONSTITUTION:A wafer 9 is correctively driven up to the inside of a region, where detection of the wafer is disenabled, by a X-Y stage 7 for step and repeat exposure. Therefore, a reticle 2 and the wafer 9 can be exactly positioned on optical reference surfaces conjugated in a projection optical system. When a plurality of patterns for a semiconductor element are formed on the reticle 2 and a plurality of pattern images for the semiconductor element are printed on the wafer 9 by one shot of exposure operation, the amount of corrective driving is made to be integer times the dimension of one pattern image for the semiconductor element, and after the corrective driving the distance between the wafer 9 detection position and the wafer 9 exposure position is selected to be minimum. Hence, states of a wafer reflective surface are made identical to each other on the detection position and on the exposure position so that detection errors on the reflective surface can be removed. |
