发明名称 SEMICONDUCTOR DEVICE
摘要 PURPOSE:To vary the function of a lead or a wiring simply as required by using a covered wire, in which the surface of a metallic wire is covered with an insulator, and crossing the covered wire with a covered wire adjacent to said covered wire. CONSTITUTION:A semiconductor chip 2 and inner lead sections 3A in a lead 3 are connected by covered wires 4. These chip, inner lead sections and covered wires are sealed with a resin seal member 5. The wire 4 is shaped by covering the surface of a metallic wire 4A with an insulator 4B. When the position of arrangement of the lead for reference voltage and the position of arrangement of the lead for supply voltage are varied, the wires 4 are crossed, the wires 4 are connected to each of an external terminal 2A(VCC) for reference voltage and an external terminal 2A(GND) for supply voltage. Accordingly, the function of the lead or a wiring is varied simply as required.
申请公布号 JPS63187639(A) 申请公布日期 1988.08.03
申请号 JP19870018367 申请日期 1987.01.30
申请人 HITACHI LTD 发明人 TANIMOTO MICHIO;OZAWA MASAKAZU;OKAMOTO MICHIO;YASUDA HAJIME
分类号 H01L21/60;H01L23/49;H01L23/495;H01L23/50 主分类号 H01L21/60
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