| 摘要 |
PURPOSE:To eliminate the defective bonding and to enhance the yield rate by a method wherein, on a printed-circuit board, a groove is formed between a first region where a chip device can be bonded and a second region which is situated to be adjacent to the region and where a metal thin wire can be pressure-bonded. CONSTITUTION:A groove 5, whose internal size is 5.5 mm, external size is 6.5 mm (accordingly, its width is 0.5 mm) and depth is 0.4 mm, is made at a printed-circuit board 1 at the periphery of a silicon semiconductor chip device; a silver paste 3 is dropped into the region and is not spread outside the groove. A semiconductor chip device 4 is connected to lead terminals installed in other regions on the printed-circuit board 1 by using metal thin wires 6. The groove 5 made on the surface of the printed-circuit board can prevent the silver paste from being spread more than required and from being oozed to the lead terminals on the printed-circuit board because the silver paste 3 squeezed out from directly under the semiconductor chip device 4 can be dropped into the groove 5.
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