发明名称 REFLOW SOLDERING DEVICE
摘要 PURPOSE:To prevent the unevenness of soldering by heating equally a substrate, by constituting the titled device so that a fan rotate, and the flow of heated air passes through a straightening vane and becomes a laminar flow, and is blown to the whole printed board. CONSTITUTION:Air heated by sheath heaters 11, 12 or a far infrared radiation heater 10 goes out to the outside from an exhaust port 28 and from between side plates 26 and ascends, is sucked from the inlet port 27 of the upper part of the side plate 26, and brought to air blasting by the rotation of fans 13, 14 and 15. The heated air is straightened and becomes a laminar flow by passing through a straightening vane 25, blown equally to a printed board 1, and the board 1 is heated equally. In such a way, solder paste 3 is melted equally, and the printed board 1 of a high quality having no unevenness in soldering is obtained.
申请公布号 JPS63177960(A) 申请公布日期 1988.07.22
申请号 JP19870008965 申请日期 1987.01.20
申请人 KONDO KENJI 发明人 KONDO KENJI
分类号 B23K1/012;B23K1/008;H05K3/34 主分类号 B23K1/012
代理机构 代理人
主权项
地址