发明名称 |
Thermal protective device with bimetal for semiconductor devices and the like |
摘要 |
A thermal protective device for semiconductor devices and the like comprises a housing of electrically insulative plastic material made in cup form having at the open end a seat for lodging a bimetallic disc and means for applying the cup to the semiconductor device with the bimetallic disc in direct heat exchange relation therewith. One or more electric terminals is incorporated in the housing at the time of molding and is connected in power supply circuits of the semiconductor device and/or alarm and signaling circuits. The bimetallic disc acts on said electric terminals so as to interrupt or modify the power supply to the semiconductor device or to actuate an alarm signal.
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申请公布号 |
US4758876(A) |
申请公布日期 |
1988.07.19 |
申请号 |
US19860919159 |
申请日期 |
1986.10.15 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
CALENDA, CIRO;IMBIMBO, FIORENTINO;NOTARO, GIUSEPPE |
分类号 |
H01L23/58;H01H37/54;H01L23/34;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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