| 摘要 |
PURPOSE:To improve the optical characteristics of an optical semiconductor device by sealing an optical semiconductor element with optically transmissible resin in the cavity of a mold in which its surface is coated with mold release agent and removing the vicinity of the surface of the resin to become an optical path. CONSTITUTION:The line sensor 3 of a semiconductor photodetector is electrically connected by conductive lead wirings 4 to conductive leads 2, and disposed on an island 5 in the cavity of a mold in which its surface is coated with mold release agent. After transparent epoxy resin 1 of cured acid anhydride is poured in the cavity as transmissible resin, it is cured to seal the sensor 3. Then, when the vicinity of the surface 6 of the transparent epoxy resin to become an optical path to the sensor 3 is removed by mechanical polishing or cutting 50mum from the surface 6, most of the mold release agent or gaseous impurity 7 is removed. Thus, factors which affect adverse influence to the optical characteristics of the sensor 3 are removed to improve the optical characteristics.
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