发明名称 DEVICE FOR PACKAGING ELECTRONIC COMPONENT
摘要 PURPOSE:To improve the connecting quality of an electronic component with a board by providing the pressurizing part driving a heating head, arranging the control part of the pressurizing force as well and holding the pressurizing power for the board of the electronic component at an optimum value. CONSTITUTION:The pressurizing part 9 equipped with a hydraulic cylinder part 20 at the upper part of the heating part 8 having a heater chip 14 is provided and the heating part 8 and pressurizing part 9 are arranged by linking them via a piston rod 18a. The pressure control part 10 consisting of a fluid controller 22, fluid body feeding part 21 and switch part 23 is arranged by connecting it to the pressurizing part 9. A cylinder 17 is actuated to pressurize the electronic part 30 held on the heating head 8 to a substrate 50 with the pressurizing part 9. The pressurizing force acting on the heating head 8 is held by switching to the optimum value by operating the switch part 23 of the pressurizing control part 10. Since the electronic component 30 and board 50 are connected with the optimum pressurizing force, its connection quality is improved.
申请公布号 JPS63174780(A) 申请公布日期 1988.07.19
申请号 JP19870005740 申请日期 1987.01.12
申请人 TOSHIBA CORP 发明人 KOMARU MINORU;KOIZUMI EIJI
分类号 B23K3/00;H05K3/34;H05K13/04 主分类号 B23K3/00
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