| 摘要 |
PURPOSE:To obtain a lead plating layer with good adhesion to copper by forming a hot-dipped plating layer of lead alloy on the surface of a copper collector and forming an electroplating layer of lead thereon. CONSTITUTION:After a hot-dipped plating layer 2 of lead alloy is formed on the surface of an expanded copper collector 1 immersed in molten lead alloy, an electroplating layer 3 of pure lead is formed on foregoing layer in a lead plating solution as a grid. Using such a grid for a negative electrode, life tests of a lead battery composed of 4 plates of positive electrode and 5 plates of negative electrode are carried out. At a point of time elapsed 1800 cycles, the amount of gas generated during standing is almost same as the initial value indicating a good result in itself. By such arrangement of forming a hot-dipped plating layer of lead alloy and an electroplating layer of lead upon the copper or copper alloy collector, a lead coating layer with good adhesion to copper can be obtained. |
