INTEGRATED CIRCUIT CHIP PACKAGING CONSTRUCTION

摘要

An integrated-circuit (IC) chip packaging construction in which a chip package is fabricated from a material having a relatively high thermal conductivity and input/output leads are fabricated from a conductor material having a relatively low electrical resistance. The chip packaging construction includes an upper and lower cover for enclosing an IC chip and a pair of insulating frames for hermetically sealing the IC chip in the chip package. A plurality of input/output leads extend through openings in the insulating frame to make electrical connections with the IC chip. The upper and lower covers are preferably fabricated from copper or an alloy of beryllium and aluminum. The input/output leads are preferably fabricated from copper and the insulating frame is preferably fabricated from a glass-ceramic material having a coefficient of expansion approximately equal that of the upper and lower covers.