发明名称 BAKING DEVICE FOR IC PATTERN
摘要 PURPOSE:To level a speckle pattern, and to image only a mask pattern for exposure accurately onto a member to be exposed particularly even in a fine pattern by mounting an optical element changing the phase of an optical laser with time to a laser magnifying optical system smoothing the intensity distribution of laser beams on the exposure of the pattern. CONSTITUTION:When a driver 10 is started, a section near the central section of optical fiber flux 8 is vibrated in a laser magnifying optical system 2. When the optical fiber flux 8 through a driving shaft 9 is vibrated by the driver 10, the way of the reflection of laser beams in an optical fiber is altered, and the phase of laser beams emitted from the optical fiber flux 8 changes with time. Consequently, since the shape of a speckle pattern appearing on a wafer 4 varies with the change of the phase of laser beams, the speckle pattern is levelled when the wafer 4 is exposed to laser beams for a fixed time, and only an IC pattern can be exposed onto the wafer 4. Only the minimum pattern size section of the speckle pattern appearing on the imaged pattern is vibrated in the quantity of vibrations at that time.
申请公布号 JPS63173322(A) 申请公布日期 1988.07.16
申请号 JP19870003963 申请日期 1987.01.13
申请人 TOSHIBA CORP 发明人 ONO AKIRA
分类号 B23K26/06;B23K26/073;B23K26/08;G03F7/20;H01L21/027;H01L21/30;H01S3/101 主分类号 B23K26/06
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