发明名称 RESIN SEALED TYPE SEMICONDUCTOR DEVICE
摘要 <p>PURPOSE:To increase adhesion on the interface between a frame and a resin by forming a fine ceramics coating film onto the surface of a metallic member. CONSTITUTION:A fine ceramics coating film 11 is shaped onto the whole surface of the surface and rear of a frame 11 through a method such as a CVD method as shown in an oblique line, and an integrated circuit element 3 is bonded with a die pad 4. The integrated circuit element 3 and leads 5 are connected by gold wires 6, and these gold wires, integrated circuit element and leads are sealed with a resin. Single oxide group alumina, the composite oxide of silicon oxide and alumina or the silicon nitride of non-oxide group ceramics is used as the fine ceramics coating film at that time. Accordingly, bonding power between the frame 1 and the resin is increased by the formation, etc. of firm hydrogen bonds between the fine ceramics coating film 11 being shaped and the resin.</p>
申请公布号 JPS63169747(A) 申请公布日期 1988.07.13
申请号 JP19870002271 申请日期 1987.01.08
申请人 MITSUBISHI ELECTRIC CORP 发明人 KATO SUNAO;FUKUSHIMA JIRO
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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