| 摘要 |
PURPOSE:To prevent the marking on a semiconductor package from being rubbed out by providing a transparent protecting film which covers the marking on the surface of the package. CONSTITUTION:Resin used as a product coating material, such as silicon transparent resin solution 1 is contained in a vessel 2, and a can case transistor 3 which is already sealed is dipped in the solution 1. Then, when the transistor is removed and dried, a silicon protecting film 5 for protecting a sealing 4 is formed on the transistor 3. Thus, a semiconductor device of high quality in which a sealing display is not removed by rubbing it at its sealing surface or with its solvent in a flux cleaning step after the product is soldered.
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