发明名称 |
PROCESS FOR PROVIDING ELECTRICAL CONNECTIONS TO AND PACKAGING OF PLANAR SEMICONDUCTOR DEVICES AND INTEGRATED CIRCUITS, AND PRODUCTS SO OBTAINED |
摘要 |
Grounding of source contacts (S) of flat devices and integrated circuits (of the FET type) is carried out according to the following process steps: a GaAs wafer is applied on a support and is covered on its free or rear face with photoresist; the latter is then etched along the border lines of the single FETs; the GaAs layer between contiguous FETs is removed also to make accessible the contacts S; a layer of noble metal is then deposited on the FET rear faces, so that it bridges the contacts S; the single metallized devices are disconnected from the initial support and finally are soldered to a package base. |
申请公布号 |
GB2161650(B) |
申请公布日期 |
1988.07.13 |
申请号 |
GB19850015479 |
申请日期 |
1985.06.19 |
申请人 |
* TELETTRA TELEFONIA ELETTRONICA E RADIO S P A |
发明人 |
GIAMPIERO * DONZELLI |
分类号 |
H01L21/338;H01L21/58;H01L21/74;H01L27/06;H01L29/06;H01L29/417;H01L29/812 |
主分类号 |
H01L21/338 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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