| 摘要 |
PURPOSE:To prevent the abnormal thickening of the thickness of a resin near the center of a wafer, etc. by mounting a gas spraying nozzle spraying a gas near the center of a wafer when a resin is discharged from the nozzle or during revolution. CONSTITUTION:A gas 8 is sprayed near the center of a wafer 4 from a gas spraying nozzle 7 when a resist is discharged from a nozzle 6 or during revolution. Accordingly, the gas spraying nozzle spraying the gas against the center of the wafer is mounted, thus preventing the extreme thickening of the thickness of a resin in the vicinity of the center.
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