发明名称 ADHESIVE FOR CHIP COMPONENT
摘要 <p>PURPOSE:To provide the title adhesive having excellent storage stability, coatability, heat curing rate and bond strength, consisting of a polymerizable prepolymer, a reactive diluent, a polymn. initiator, a chelating agent and a polymn. inhibitor. CONSTITUTION:100pts.wt. photopolymerizable prepolymer (A) having an MW of 1,000-10,000 (e.g., an unsaturated polyester resin having ethylenically unsaturated bonds) is blended with 30-100pts.wt. reactive diluent (B) [e.g., diglycidyl ester di(meth)acrylate of a 4C or higher dibasic fatty acid], 0.2-20pts.wt. polymn. initiator (C) (e.g., benzoin methyl ether), 0.002-2pts.wt. polymn. inhibitor (E) (e.g., hydroquinone) and optionally a curing accelerator, an inorg. filler, a colorant, a thixotropic agent, etc. (F).</p>
申请公布号 JPS63168478(A) 申请公布日期 1988.07.12
申请号 JP19860314021 申请日期 1986.12.27
申请人 SOMAR CORP 发明人 FUJII RYUICHI;NAGASE RIHEI
分类号 H05K3/34;C09J4/00;C09J4/02;C09J4/06;C09J167/06;H05K3/30 主分类号 H05K3/34
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