| 发明名称 |
METHOD OF FORMING A PRESSURE-CONTACT TYPE SEMICONDUCTOR DEVICE |
| 摘要 |
<p>The present invention relates to a method of manufacturing a semi-conductor device by providing a projection formed by pressing the side wall portion of a metal cylindrical body from the outside toward the Inside of the cylindrical body and engaging an outer peripheral edge of the upper surface of the cylindrical elastic member contained In the cylindrical body with the projection.</p> |
| 申请公布号 |
CA1239229(A) |
申请公布日期 |
1988.07.12 |
| 申请号 |
CA19850489870 |
申请日期 |
1985.09.03 |
| 申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
OHDATE, MITUO |
| 分类号 |
H01L21/60;H01L23/049;H01L23/48;(IPC1-7):H01L21/48 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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