| 摘要 |
PURPOSE:To keep the hardness of a ball low in comparison with the case where the ball is not heated and to obtain excellent bondability, by supplying a high temperature gas around the ball, which is fused and formed at a tip of a piece of wire, and heating the ball. CONSTITUTION:A ball 5a is fused and formed at the tip of a piece of wire 5. The ball 5a undergoes thermal compression bonding to a body to be bonded, and the wire is connected. In this wire bonding method, a high temperature gas 21 is supplied around said ball 5a, and the ball 5a is heated. For example, a discharge electrode 16 is brought close to the lower end of a copper wire 5, and a power source circuit 17 is closed. Then the ball 5a is fused and formed at the tip of the copper wire 5. At this time the reducing gas 21 is supplied from a tube 18. A part between the wire 5 and the electrode 16 is kept in a reducing gas atmosphere. The reducing gas 21 is heated with a heater 20, which is provided in the middle of the tube 18. Therefore the gaseous atmosphere becomes the high temperature atmosphere. Thus the ball 5a formed at the tip of the wire 5 is heated. |
