| 摘要 |
PURPOSE:To prevent the contact of the loop of a wire with a semiconductor element by a method wherein a bonding is performed and after a tool is made to ascend, the tool is displaced in an oblique lower direction to recede from a second bonding part to form a bending part on the wire and the tool describes a circular arc-shaped locus and is moved to the second bonding part. CONSTITUTION:A bonding tool 1 is positioned at a point A above an electrode 4a of a semiconductor element 4 die-bonded on a lead frame 3 and after a bonding is performed, the tool 1 is made to again ascend to the point A. With an XY table moved in a direction to recede from a terminal 3a of the lead frame 3, which is a second bonding part, by a dimension (b), the tool 1 is descended by a dimension (c) and a bending part 6 protruding in a -X direction is formed on a wire 5. The tool 1 describes a relatively circular arc-shaped locus and is displaced above the terminal 3a. As a result, as the bending part 6 is formed, the wire 5 is slanted in the ascending direction toward the bending part 6 from a ball part 5a and does not come into contact to an edge part 7 even though a bonding height (d) is made sufficiently lower. |
