| 发明名称 |
THICK FILM CONDUCTOR COMPOSITIONS |
| 摘要 |
<p>Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.</p> |
| 申请公布号 |
IE53130(B1) |
申请公布日期 |
1988.07.06 |
| 申请号 |
IE19820001559 |
申请日期 |
1982.06.29 |
| 申请人 |
E.I. DU PONT DE NEMOURS & COMP. |
发明人 |
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| 分类号 |
C22C32/00;H01B1/16;H01G4/008;H05K1/09;(IPC1-7):H01B1/02;H01L27/01;H01G1/01 |
主分类号 |
C22C32/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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