Process for the production of self-adjusted bipolar transistor structures having a reduced extrinsic base resistance

摘要

Self-adjusted bipolar transistors having reduced extrinsic base resistance are produced by forming an emitterterminal from a polysilicon layer structure and etching free the polysilicon layer structure using the emitter layer structure as a mask. Sidewall insulating layers are provided with a metallically conductive layer. This layer is self-adjusting in relation to the emitter zone and surrounds the emitter in an annular formation. The structure improves the foursided base wiring around the emitter and is used in the production of highly integrated bipolar circuits.