| 摘要 |
PURPOSE:To enhance the thermal resistance against a solder material and the reliability against dampproofness by a method wherein an iron-related lead frame is used as a lead frame whose part to be sealed by using a thermosetting epoxy resin molding material is formed by a film containing copper, zinc or the like in the form of a metal and/or its compound. CONSTITUTION:An epoxy resin molding material is normally the epoxy resin molding material for semiconductor-sealing use, e.g., a cresol-novolac epoxy resin, a phenol- novolac epoxy resin or a material which is composed by adding a hardening agent to a brominated substance of each of these epoxy resins. An iron lead frame is composed of an iron/nickel alloy; the part to be sealed is formed by a film composed mainly of at least one out of metals, i.e., copper, zinc, tin, nickel, and/or its compound whose adhesion performance in relation to a sealing resin is good; the surface roughness of the coated film is made to be at least more than 1 mum according to the requirement in order to strengthen the adhesion between this coated film and a sealing resin; in addition, it surface is treated by various chemical processes so that the affinity to the sealing resin can be enhanced. Accordingly, the airtightness is excellent; no crack is caused at the package when the package is treated by heating a solder material.
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