| 摘要 |
PURPOSE:To eliminate a residual substance or the like of a surface-protective film after removal of this film after completion of a grinding process by a method wherein a film having a shock-absorbing effect is formed on a suction stand so that a protective tape which is glued to the surface of a semiconductor substrate by using an adhesive becomes unnecessary. CONSTITUTION:A semiconductor substrate 1 which has been transferred to a suction stand 3 is fixed to the suction stand 3 in such a way that its surface side, i.e. the side of a protective structure, is sucked by a vacuum-suction effect of the suction stand 3 through a protective film 4. Because the protective film is composed of a porous material, its suction effect remains unchanged. Then, a grinder 5 is pressed to the rear of the semiconductor substrate 1 while it is being turned; the reverse face is ground until a desired thickness is obtained. The force which is exerted to the semiconductor substrate 1 by the grinder 5 is reduced due to a shock-absorbing effect of the protective film 4 and a resin thin film 2; the surface of the semiconductor substrate is protected. After a prescribed grinding process of the rear of the semiconductor substrate 1 has been completed, the semiconductor substrate 1 is detached from the suction stand 3; the resin thin film 2 is ashed by using oxygen gas or the like and is removed.
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