发明名称 BINDER FOR PASTE SOLDER
摘要 PURPOSE:To prevent corrosion of solder powder and oxidation of base metals and to improve soldering workability by mixing 1 or 2 kinds of polybutene and polyisobutyrene and org. gelling agent respectively at prescribed % with specific weight % of n-hexane. CONSTITUTION:The binder for paste solder is obtd. by mixing 30-80% 1 or 2 kinds of polybutene and polyisobutyrene with 20-70% n-hexane, and further, adding 0.25-3% org. gelling agent thereto, then agitating and heating the mixture. The corrosion of the solder during storage is prevented by the gelation of the binder and the oxidation of the base metals when the solder is coated thereon are prevented if the paste solder is prepd. by adequately mixing and agitating this binder and the solder powder. Further, the splashing of the binder during soldering is obviated by the viscosity adjustment of the binder and the generation of residue is obviated as well. The soldering workability is, therefore, improved.
申请公布号 JPS63160795(A) 申请公布日期 1988.07.04
申请号 JP19860314054 申请日期 1986.12.24
申请人 TANAKA KIKINZOKU KOGYO KK 发明人 KASHIWAGI KOZO;YANAGISAWA HIDEKAZU
分类号 B23K35/22;C08K5/01;C08L23/20 主分类号 B23K35/22
代理机构 代理人
主权项
地址
您可能感兴趣的专利