发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To facilitate the resin sealing process while increasing the material efficiency of lead frame by a method wherein the injection parts of two stage resin sealing parts are formed on a straight line perpendicularly in the long direction of lead frame. CONSTITUTION:Resin sealing parts 2, 3 are obliquely arranged on up and down two stages in the short direction of frame 1 while the resin injection ports 5, 6 are connected to the angular parts of resin sealing parts 2, 3. The resin formed on a straight lines perpendicularly in the long direction of frame 1 passes through the resin injection port 5 to fill the resin sealing part 2 further passes through the other resin injection port 6 to fill the other resin sealing part 3. In such a constitution, the resin injection ports 5, 6 can be formed easily while the resin with excellent fluidity can be filled smoothly without fail to facilitate the resin sealing process for increasing the material efficiency of lead frame.
申请公布号 JPS63160259(A) 申请公布日期 1988.07.04
申请号 JP19860315465 申请日期 1986.12.23
申请人 MITSUBISHI ELECTRIC CORP 发明人 MICHII KAZUNARI
分类号 H01L21/56;H01L23/50 主分类号 H01L21/56
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