| 摘要 |
PURPOSE:To obtain the sealing method of high reliability, high yield rate and high efficiency by a method wherein a cap of square shape in plane view is placed on a seal frame, a roll electrode is brought to come in contact with the cap, the cap is rotated, and a current is applied to it. CONSTITUTION:A semiconductor package 41, whereon a square-shaped seal frame 44 which is smaller than a substrate 41' in square shape is provided on the square shaped substrate 41'. A square-shaped cap 43 is positioned and placed on a square-shaped seal frame 44 and a switch is turned ON. A roll electrode 35 is lowered by the power of an air cylinder and it presses the square-shaped cap 43. A rotating pedestal 42 begins to rotate in the direction shown by the arrow 50, and then a current is applied. The rotating pedestal is rotated and a welding work is conducted smoothly. A sealing of the shorter side and the longer side corner parts can be accomplished by the variation of vertical movement of the roll electrode 35 while the rotating pedestal 42 is being rotated at 360 deg.. |
