| 摘要 |
PURPOSE:To obtain magnetic heads of high quality with high productivity by forming a working deteriorated layer and a track width prescribing groove on the forming surface of a wafer and grinding the surface of the wafer into a mirror surface to delete the cracks of tracks produced when the track width prescribing groove is formed. CONSTITUTION:The working deteriorated layers 14a and 14b of amorphous materials are formed on the gap forming surfaces of wafers 12a and 12b. The V-shaped track width prescribing grooves 15a and 15b are added to the wafers 12a and 12b. Thus the desired track width is obtained. A track crack produced when the grooves 15a and 15b are formed is deleted by the grinding treatment of the layers 14a and 14b. This grinding speed is increased setting the thickness of each of layers 14a and 14b at about 3mu and at the same time the crack 19 is also deleted. Thus the quality of the head gap forming surface is improved and the productivity is improved for magnetic heads.
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