Potentially adhesive electrically conductive composition.

摘要

The present invention relates to potentially adhesive electrically conductive compositions and to films formed from these compositions which are capable of being employed in particular for the adhesive bonding of the surfaces of electronic devices. These compositions are characterized in that they comprise a thermoplastic polyblock organopolysiloxane copolymer with elastomeric properties and particles whose surface at least is electrically conductive and, if appropriate, a solvent or diluent.