| 摘要 |
PURPOSE:To provide an adhesive compsn. which can bond print wiring boards etc., to each other uniformly, reproducibly and in semi-cured state, consisting of a thermosetting epoxy methacrylate resin compsn., a specified thermosetting epoxy resin compsn., a filler and a thixotropic agent. CONSTITUTION:100pts. (by weight; the same applies hereinbelow) resin such as a bisphenol epoxy methacrylate resin is blended with 10-200pts. copolymerizable crosslinking agent (e.g., diallyl phthalate) and a radical polymn. initiator having a decomposition temp. of 50-120 deg.C (e.g., benzoyl peroxide) to obtain a thermosetting epoxy methacrylate resin compsn. (A). The component A is mixed with a thermosetting epoxy resin compsn. (B) which consists of an epoxy resin and a curing agent (e.g., methylnadic anhydride) and is not or difficultly cured by heating at a temp. of the curing temp. of the component a, but is cured by heating at a temp. higher than the curing temp. of the component A, in a ratio of 1/9-9/1. A filler and a thixotropic agent are added to the mixture to obtain an adhesive compsn. having a viscosity (Brookfield viscometer at 25 deg.C) of 200-500ps at a shear rate of 1sec<-1> and a thixotropy index of 10-60 as measured at a viscosity ratio of shear rate of 1sec<-1>/shear rate 100sec<-1>.
|
