| 摘要 |
PURPOSE:To contrive not to cause short circuit failure in contact with an adjacent lead frame by the sliding movement of bonding wires along the tip, by partially cutting the tip of an inner lead frame. CONSTITUTION:Bonding pad parts 8... are arranged at the peripheral edge of a semiconductor pellet 7. A part of the inner lead parts 9a, 9b, 9c... is cut so as to become nearly rectangular to Au wires 10... wired between said parts 8.... If the edges are rectangular to the Au wires 10... like the inner leads 9a and 9f, it is not necessary to cut to an irregular shape. Even when the Au wires 10... are drawn out excessively than a right length, resulting in the excessive sag of a wire loop, the sliding movement along the edges of the Au wires 10 can be prevented, and then there is no possibility of causing short circuit failure in contact with the adjacent lead part by bending and deformation. |
