| 摘要 |
PURPOSE:To improve the rigidity and the corrosion resistance of the titled diaphragm by vapor-depositing aluminum layer on one surface of a high polymer film, masking a conductive pattern with photoresistive agent, removing the aluminum layer other than the conductive pattern by dissolving, then forming a ceramic layer on the surface of the conductive pattern by means of electrolytic deposition. CONSTITUTION:The aluminum layer is deposited on one surface of the high polymer film, and the surface is masked with a photoresistive agent on the conductive pattern. Thereafter, the film is dipped in an acid or alkali solution to remove the aluminum layer other than the masked part by dissolving, and thus the conductive pattern is formed on one surface of the high polymer film. Then the ceramic layer is formed by means of electrolytic deposition. The film is dipped in an electrolyte as 30g/l sodium aluminate solution and the conductive pattern is used as an anode and an iron plate as a cathode, and a DC current is made continuously flowing while maintaining the anode current density at 1A/dm<2>. By applying the current for twenty minutes, a 4-5mum thickness of the ceramic layer of aluminum oxcide is formed on the conductive pattern of aluminum.
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