| 摘要 |
PURPOSE:To densify and smooth a thin film to be obtained by vibrating a material to be worked. CONSTITUTION:Thin film is formed on a substrate 1 to be worked by using a dry vapor-phase plating method using a high-frequency magnetron sputtering device. At this time, the substrate 1 is vibrated, for example, by using an ultrasonic oscillator 3. The substrate 1 can be further rotated or reciprocated while vibrating the substrate. By this method, growth of a columnar crystal from the surface of the substrate 1 is prevented, and the crystal grains are made fine. Accordingly, voids are not generated in the grain boundary, a dense thin film without defects of pinholes, etc., is formed, and the surface of the thin film is smoothed.
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