| 摘要 |
PURPOSE:To prevent an island part from being inclined due to a jig used at the time of partial plating, by providing a projecting part for the island part of a lead frame for a semiconductor device. CONSTITUTION:An island part 1, on which a semiconductor element is mounted, and leads 2, which support this island part 1, are provided. This island part 1 is provided with a projecting part 3 which is extended outwardly from a partially plated area 4. Hence, this simple composition prevents the island part 1 from being inclined due to a jig used at the time of partial plating. Since no plating is excessively performed on sides or a rear of the island part 1, a high-quality lead frame can be obtained for a semiconductor device.
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