| 摘要 |
PURPOSE:To prevent peeling of polyimide on an electrode or a wiring metal, by covering the surface of an electrode or a wiring metal with an insulating or metallic film of good adhesiveness to polyimide. CONSTITUTION:An electrode or a wiring 2 is formed on a semiconductor substrate or an insulating material 1, and next a metallic film (e.g., Ti, TiN, Cr) 3 of good adhesiveness to polyimide is grown to then form a pattern of a photoresist 4. Successively, after said insulating or metallic film 3 of good adhesiveness to polyimide is removed in a shape of the photoresist 4, spin coating of polyimide 5 is performed thereon. Finally, a throughhole is bored in the polyimide 5 so as to form an upper layer wiring metal 6. Hence, the polyimide on the electrode or wiring can be prevented from being peeled.
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