| 摘要 |
PURPOSE:To prevent lead legs of a semiconductor device from being damaged upon being inserted into a socket, by forming upper parts of separation plates for them into trapezoidal or curvilinear shapes. CONSTITUTION:Separation plates 5 for lead legs 3 of a semiconductor device 2 are formed into trapezoidal shapes. Therefore, even if the semiconductor device 2 is inserted into a socket 1 while the lead legs 3 of the semiconductor device 2 are in contact with the separation plates 5, the lead legs 3 are not damaged by these separation plates 5. Though the separation plates 5 for the lead legs of the semiconductor device 2 are formed into trapezoidal shapes here, similar effects can be also obtained when they are formed into curvilinear shapes. Though the socket for a DIP type semiconductor device is used here, sockets for a ZIP type semiconductor device and a SIP type one can be used.
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