| 摘要 |
PURPOSE:To reduce the bonding pad of an LSI by decreasing one side end of the tip to be wire bonded in diameter smaller than the other side end, and connecting the one end to the other through a tapered step, in a capillary tip. CONSTITUTION:A compression-bonding member 4 is composed of a first tapered part 6 connected to a part 2 to be held, a columnar bonding part 7 for directly compressing a wire 3, and a second tapered part 8 formed on a boundary between the parts 6 and 7. The part 7 is formed smaller in diameter than the part 6. Then, even in wire bonding for pads at 150mum intervals or less, the bonding member 4 working on a pad will not interfere the previously bonded wire. Thus, the bonding pad of an LSI can be reduced. |
