| 摘要 |
<p>Adhesion of metal conductor layer is insulating thermplastic or thermosetting resin, pref. epoxy or phenolic resin, substrate is improved by dissolving outer metal film, pref. Cu or Ni of composite stratified panel with a chemically attacking soln. catalytically activating non-conducting surface obtained, pref. in one step with an Sn-Pd hydrosol, metal plating printed circuit zones to be rendered conductive and heating panel, at least once after catalysis, to less than substrate decomposition temp. pref. 30-105 degrees C.</p> |
