| 摘要 |
PURPOSE:To prevent the yield of a product from decreasing which is caused by large scraping damage by vibrating a probe stylus secured to a probe fixing unit, penetrating it through an oxide film on the chip of a wafer, and contacting it with an electrode pad by the addition of the mark of the stylus to measure it. CONSTITUTION:A vibrator 32 is disposed on a probe fixing unit 42 secured with a probe stylus 21, the unit 42 is vibrated to vibrate the stylus 21 secured to the fixing unit to break the oxide film on a wafer by the upward and downward movements of the stylus 21, thereby contacting the stylus 21 with the pad. Since the number of the vibrations is preset according to the type of wafer, the pad itself is not damaged. Since the probe stylus has an array structure near perpendicularity, a plurality of probe styluses corresponding to a plurality of chips can be disposed on a substrate 10. That is, the probe styluses 21 which can measure simultaneously a plurality of chips such as chips A, B, C can be arrayed.
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