| 摘要 |
PURPOSE:To obtain an adhesive composition having high adhesivity and improved heat-resistance and chemical resistance, by using a compound having (meth)acrylamide group and epoxy group, an epoxy resin hardener and a radical polymerization initiator as essential components. CONSTITUTION:The objective adhesive composition contains, as essential components, (A) a compound containing >=1 (meth)acrylamide group and >=1 epoxy group [preferably a glycidyl compound of formula (Ar is 6-20C aromatic hydrocarbon group having >=1 glycidyloxy group; R is H or methyl; n is 1-4), etc.], (B) an epoxy resin hardener (preferably aromatic diamines, imidazoles, etc.) and (C) a radical polymerization initiator (preferably t-butyl hydroperoxide, t-butyl peroxybenzoate, etc.).
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