发明名称 MOLDING EQUIPMENT FOR MULTILAYER STRUCTURE RESIN MOLDED FORM
摘要 PURPOSE:To change the thickness dimensions of a skin layer resin through sandwich molding by temperature control, and to give the permeation concentration of a core layer resin material a dense change by forming a linear region or a surface-shaped region different in temperature from a peripheral mold surface to one part of an inner wall surface facing a cavity. CONSTITUTION:A skin layer resin material A is injected into a cavity 32a. A core layer resin material B is injected into the cavity 32a. When the temperature T1 of a heater 40a for a mold member 32A is set at 120 deg.C, the temperature T2 of a heater 40b at 130 deg.C and the temperature T3 of a heater 40c at 140 deg.C at that time, the cooling of the skin layer resin material A is made slower than a mold member 32B because the temperature T3 of a mold member 32C is higher than that T2 of the mold member 32B. Accordingly, thickness dimensions t5 in the mold member 32C of the skin layer resin material A extruded by the core layer resin material B is made thinner than those of the skin layer resin material in a mold member 32B section.
申请公布号 JPS63139719(A) 申请公布日期 1988.06.11
申请号 JP19860286244 申请日期 1986.12.01
申请人 CANON INC 发明人 KAWANO KATSUO;ARAI TAKASHI;OKAJIMA HIDEKAZU
分类号 B29C45/16;B29C45/73;B29L9/00;B29L11/00 主分类号 B29C45/16
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