| 摘要 |
PURPOSE:To bond a wire positively without forming a metallic ball at the tip of the metallic small-gage wire by using a capillary not limited in the direction of movement by controlling the operation of the capillary. CONSTITUTION:A capillary 13 in which a metallic small-gage wire 14 is projected from a nose in predetermined length prior to bonding is arranged to the upper section of a wire-tip position 11'' set separate slightly from a position 11' where the small-gage wire 14 is bonded, and the capillary 13 is lowered until the tip of the metallic small-gage wire 14 is brought into contact with the wire-tip position 11''. The tip of the metallic small-gage wire 14 is shifted to the position 11' where the small-gage wire 14 is bonded while the capillary 13 is brought down, the metallic small-gage wire 14 is pressed down by the nose of the capillary 13, and ultrasonic vibrations are applied to the metallic small-gage wire 14 and the metallic small-gage wire is bonded. Accordingly, the metallic small-gage wire 14 can be bonded without shaping a metallic ball at the tip of the metallic small-gage wire 14 by employing the capillary 13 not limited in the direction of movement. |
