| 摘要 |
<p>PURPOSE:To strengthen the adhesive strength of the joint surfaces of an electrode and a header lead by forming a groove to an electrode section bonding the electrode and the header lead, storing a header section in the lead into a groove section and wrapping the header section with a solder material. CONSTITUTION:A groove section 9 deeper than the thickness of a header is shaped to the bonding section of an electrode 3 and a header lead 4 so that a header section in the lead is stored. A high temperature furnace is passed on the joint surfaces of the electrode 3 and the header lead 4 through a solder material 2 on bonding, and the solder material 2 is mounted so as to wrap the header section. Consequently, strength only of the joint surfaces of the solder material 2 interposing between the conventional electrode 3 and header lead 4 is not included in adhesive strength, and the header lead 4 is bonded with the groove section 9 in the electrode, and the whole header section of the lead is wrapped with the solder material. Accordingly, a bonding area is increased, and adhesive strength is augmented.</p> |
