| 摘要 |
PURPOSE:To obtain a photosensitive compsn. for manufacturing LSI, etc. prevented from striation in coating and sticking phenomenon in contact exposure by incorporating a surfactant in a specified ratio to a solid component of an org. polymer type photoresist. CONSTITUTION:A photosensitive compsn. is prepared by incorporating 0.001- 2wt% surfactant by the solid basis in an org. polymer type photoresist using UV rays, far UV rays, X rays, or electron beams for exposure, especially a positive type photoresist of a combination of a phenol novolak resin and o-quinonediazide, etc. A surfactant soluble in an org. solvent contained in the photosensitive compsn. is usable, and when said compsn. is used for manufacturing semiconductors, organosiloxane polymers, fluorinated surfactants, and acrylic polymers are suitable. As a result, the obtained compsn. is prevented from fine striations occurring on the surface of a photoresist at the time of coating and sticking to a mask at the time of contact exposure. |
