| 摘要 |
<p>PURPOSE:To improve the throughput of a plasma processor by simultaneously executing wafer (an element to be processed) loading and unloading operations by one conveying mechanism. CONSTITUTION:A conveying ring 12a is disposed at a processing position on the bottom of a processing chamber 10, and a wafer 16a is plasma-processed in the state that the chamber 10 is sealed. The wafer placing unit 15a of a stage 15 supports a wafer 16a through the ring 12a. A new wafer 16b is placed on one ring 12b during standby out of a reaction vessel 11. The plasma processing of the wafer 16a in the chamber 10 is finished in this state. Then, a whole conveying mechanism is moved down, and the vessel 11, the ring 12 and the stage 15 are elevationally separated from each other. The wafer 16a is moved from the state 15 onto the ring 12a at this time. Then, a rotary arm 13 is rotated at 120 deg., the wafer 16a on the ring 12a is conveyed out, a waiting ring 12b is moved to the lower section of the vessel 11, and a new wafer 16b is disposed at a processing position.</p> |
