| 摘要 |
A device for supporting patching compounds in its plastic state during the repair of holes in building walls of gypsum board construction. The backing device includes an apertured, foldable plate member which may be inserted through the hole to be patched and then erected so as to cover the hole. The invention is also characterized by a telescoping support member which passes through the aperture in the foldable plate and will retain the plate in position by acting against the plate and the inner surface of the opposing wall.
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