发明名称 Resin-molded semiconductor device having heat radiating plate embedded in the resin
摘要 A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.
申请公布号 US4750030(A) 申请公布日期 1988.06.07
申请号 US19860942229 申请日期 1986.12.16
申请人 NEC CORPORATION 发明人 HATAKEYAMA, MIKIO
分类号 H01L23/28;H01L23/31;H01L23/433;H01L23/48;H01L23/495;H01L33/00;(IPC1-7):H01L23/28 主分类号 H01L23/28
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